HPC_Guru , 10 days ago TSMC explores radical new chip packaging approach to feed AI boom Rectangular substrates to unlock more power are also being tested by Intel and Samsung https://asia.nikkei.com/Business/Tech/Semiconductors/TSMC-explores-radical-new-chip-packaging-approach-to-feed-AI-boom #AI #HPC
TSMC explores radical new chip packaging approach to feed AI boom
Rectangular substrates to unlock more power are also being tested by Intel and Samsung
https://asia.nikkei.com/Business/Tech/Semiconductors/TSMC-explores-radical-new-chip-packaging-approach-to-feed-AI-boom
#AI #HPC